HyperLight Announces $80 Million Series C to Accelerate TFLN Deployment for AI Infrastructure
HyperLight Corporation (“HyperLight”), a leader in thin-film lithium niobate (TFLN) photonics, today announced the closing of an $80 million Series C financing round led by MediaTek. The round includes participation from UMC Capital, Jabil, Foxconn, EDBI (arm of SG Growth Capital, the investment platform of the Singapore Economic Development Board and Enterprise Singapore), CDIB-TEN Capital, and Qatar Investment Authority (QIA), as well as strategic investors from leading silicon IC and networking companies. Existing investors Summit Partners, The Engine, Foothill Ventures, and Xora Innovation continue to actively support the company’s growth.
HyperLight Introduces 400G-per-lane PICs on its TFLN Chiplet™ Platform for Next-Generation AI Interconnects
HyperLight Corporation (“HyperLight”), creator of the TFLN Chiplet™ Platform, today announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) designed for next-generation AI networking infrastructure. The new PIC family delivers low insertion loss, low drive voltage operation, and exceptional electro-optic bandwidth, enabling energy-efficient and high-performance 400G-per-lane optical links.
HyperLight Demonstrates Low-Power 1.6T-DR8 TFLN-based Reference Transceiver Assembled by TFC
HyperLight Corporation (“HyperLight”) today announced a major milestone in low-power optical networking with the demonstration of a 1.6T-DR8 optical transceiver leveraging HyperLight’s TFLN Chiplet™ Platform.
HyperLight and UMC Collaborate with Jabil to Bring TFLN Photonics to Data-Center Scale Deployment
HyperLight Corporation (“HyperLight”), United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), and Wavetek Microelectronics Corporation (“Wavetek”), a wholly owned subsidiary of UMC, today announced a collaboration with Jabil Inc. (“Jabil”), to accelerate the deployment of thin-film lithium niobate (TFLN) photonics into hyperscale AI data center interconnects. The collaboration brings together HyperLight’s TFLN photonic technology, UMC and Wavetek’s qualified foundry manufacturing, and Jabil’s expertise in high-volume manufacturing and assembly to support deployment of next-generation optical modules at data-center scale.
HyperLight, UMC, and Wavetek Announce Strategic Partnership for High-Volume Foundry Production of TFLN Chiplet™ Platform
HyperLight Corporation (“HyperLight”), United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), and Wavetek Microelectronics Corporation (“Wavetek”), a wholly owned subsidiary of UMC, today announced a strategic manufacturing partnership for high-volume foundry production of HyperLight’s TFLN (thin-film lithium niobate) Chiplet™ Platform on both 6-inch and 8-inch wafers. The collaboration marks a major inflection point in the commercialization of TFLN photonics, enabling the manufacturing capacity required for AI and cloud infrastructure deployment at scale.
HyperLight Accelerates Growth With $37M Funding Led by Summit Partners
HyperLight Corporation, a leading provider of thin film lithium niobate (TFLN) photonic integrated circuits (PICs), today announced a US$37 million Series B investment led by Summit Partners. The round includes participation from existing investors Xora Innovation, a deep tech venture fund backed by Temasek, and Foothill Ventures. Peter Chung, Managing Director and CEO of Summit Partners, will join HyperLight’s Board of Directors.
